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    • 专利摘要:
    The present invention relates to a tellurium oxide glass composition for glass-to-metal alloy or metal sealing having a coefficient of thermal expansion greater than 16ppm / ° C, said composition comprising TeO2, ZnO, a oxide selected from TiO2, K2O and mixtures thereof and optionally CsCl and being substantially free of lead oxide, sodium oxide and vanadium oxide. It further relates to the use of the glass composition according to the invention for the glass-to-metal sealing of copper or a copper alloy with an alloy or a metal having a coefficient of thermal expansion greater than 16ppm / ° C. It further relates to a connector comprising a copper or copper alloy contact, an insert and / or metal or alloy housing having a coefficient of thermal expansion greater than 16ppm / ° C and as a glass-to-metal sealing material between the contact and the insert and / or casing a glass based on tellurium oxide having the composition according to the invention. Finally, it relates to a glass-metal sealing process of a copper or copper alloy contact in an insert and / or metal or alloy housing having a coefficient of thermal expansion greater than 16ppm / ° C.
    公开号:FR3036396A1
    申请号:FR1554634
    申请日:2015-05-22
    公开日:2016-11-25
    发明作者:Deken Leen De；Ning Yu；Christian Przybilla
    申请人:Axon Cable SA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to tellurium oxide glass compositions for glass-to-metal sealing and its use in hermetic connectors such as hermetic micro-D connectors.
    [0002] In the interest of making the interconnection of electronic systems more compact, the density of connection points is becoming more and more a sought-after performance, which has led to the miniaturization not only of the transmission cable, but also of the connector. Mil-DTL-83513 defines a family of male and female rectangular connectors, the connecting parts of which are D-shaped. This family, called micro-D, is characterized by a pitch of 1.27 mm, the step representing the distance between two adjacent connection points. The standard also explicitly defines the number of connection points (or the number of contacts) which are respectively 9, 15, 21, 25, 31, 37, 51 and 100. These contacts are arranged in the connector in 2 or 3 rows. as shown in Figure 1. The series of micro-D connectors began to appear massively in the market of the electronic connection in recent years. The characteristics defined by the standard MIL-DTL-83513 (micro-D 20 standard connector) that we are looking for this type of connectors are: - Insulation resistance between the contacts and between the contacts and the housing> 5 Gohm at 500V DC; - No defects after 5 cycles of thermal shock -55 + 125 ° C; - Vibration resistance: no discontinuity> 1ps at 50G; 25 - Resistance to mechanical shocks: no discontinuity> 1ps to 20G; - Retention of contact> 2.26kg.
    [0003] 3036396 2 Some special applications require specific properties for these connectors. Two properties are more and more in demand: hermeticity and magnetism.
    [0004] Hermeticity, that is gastightness, is defined by a leakage rate. The acceptable leak rate must be determined for each application. For this, it is necessary that the leakage has no influence on the operating pressure, gases or vacuum present in the equipment. Hermetic connectors are often used to provide electrical connections in vacuum equipment. In these devices, the service life of the components is often related to the maintenance of the vacuum because the equipment is often sensitive (spectrometer ...). These connectors can also separate two compartments containing different gases that must not mix or need to leave the compartment.
    [0005] Due to the increasing sensitivity of the equipment, the maximum leakage rates required for these connectors are becoming lower. To be able to measure very low leakage rates, that is to say below 1.10-9mbar.1 / s, a helium leak detector is used. Helium is the smallest atom after hydrogen and exists as an inert gas, only 5ppm in the atmosphere. The MIL-STD-883 standard is one of the standards explaining the method of measuring the leak rate for electronic components. According to the A4 conditions, the part is hermetically fixed (use of a seal and a suitable tightening) on a vacuum chamber. It is advantageous to have the lowest pressure possible in this room to have the best sensitivity. Indeed, the lower the pressure, the fewer gas molecules in the chamber and therefore residual helium, which reduces the background noise. The standard imposes a pressure lower than 0.13mbar (0.1 Torr). This chamber is connected to a calibrated mass spectrometer to achieve the expected leakage rate at 3036396 3. The calibration must be done at each period of use, thanks to a diffusion-type calibrated leak. The tightness of the assembly must be checked with a flat metal plate. This is done by spraying the helium plate with a gun. If the detector does not detect helium 5 during this check, the assembly is correct and the parts can be tested in the same way, by spraying them with helium. Amagneticity represents the non-susceptibility to be magnetized under a magnetic field. This characteristic is measured according to the procedure defined in GFSC-S-311, using a three-dimensional magnetometer. First, the initial magnetic field is measured. Then the piece is magnetized with a 500mT field using a magnet for 5min. A new residual magnetic field measurement is performed. Finally, a demagnetization phase is carried out by applying an alternating magnetic field of a value greater than 500 mT. A measurement is performed again. Thus, the other characteristics desired for the connectors, due to the specific properties that one wants to bring are the following: - Helium leak rate lower than 1X10-9 mbar.1 / s, or even lower than 20 1X10-1 ° mbar.1 / s; - Residual field less than 20nT; - Operating temperature up to 200 ° C. In addition, it is increasingly important for the connector to comply with RoHS (Restriction of Hazardous Substances). Because of the gas permeability of plastics, glass is often used to provide insulation between the contacts and the housing of a hermetic connector. The bond between one or more metal components using one or more glass parts is called a glass-to-metal seal.
    [0006] 3036396 4 Compliance with the RoHS Directive therefore implies that the glass used for the glass-to-metal sealing of the contacts in the connector housing must be lead-free, or any other compound whose use is restricted by this directive.
    [0007] The vast majority of hermetic micro-D connectors on the market are made by combining alloys with a low coefficient of thermal expansion, typically iron-nickel, iron-chromium or iron-nickel-chromium alloys, with borosilicate or vitroceramic glasses. These different materials have very close and fairly low coefficient of thermal expansion (CTE), of the order of 5 to 10ppm / ° C. This allows the materials to expand and shrink in the same way during temperature changes and to avoid the appearance of stress in the glass. This type of glass-to-metal seal is called a paired seal. To achieve these glass-metal seals, the metals are often pretreated beforehand to ensure a good bond between the materials. It is often a decarburization and a pre-oxidation. Then, glass, most of the time in the form of preforms, is kept in contact with the metals by means of a tool and the whole is heated under a controlled atmosphere. The viscosity of the glass or glass ceramic decreases and the latter binds to the metals. This solution has the disadvantage of using very magnetic materials but also very little conductors (ferrous materials). This greatly limits the maximum current flowing through the contacts and also causes deformations in the signals. Thus, the maximum current imposed by contact for these connectors is 1A, whereas for standard non-hermetic connectors using contacts in copper alloys, the amperage is limited to 3A.
    [0008] 3036396 5 Hermetic solutions available on the market allow the use of copper alloy contacts much more conductive. Patents WO9314613 and US6932644 describe these connectors. In these two patents, a copper alloy contact is sealed in a stainless steel part. We will call later this metal part in which the contacts are sealed "insert". To obtain a case made of aluminum (or titanium or another metallic material), these two patents make use of a multi-component plate, made by means of explosion welding or friction stirring, which serves as a transition joint between the metals. This plate is composed of at least two metals, intimately bound. The two patents differ in the location of this multi-material part. The first uses this plate to make the outer casing of the connector. A stainless steel-stainless steel laser weld is used to bond the stainless steel of the insert to the stainless steel case, which is part of the multi-material. The second patent claims to gain weight and reliability by using this multi-component plate to make the case insert. This is machined so that the glass-metal seal is made only in stainless steel and that the aluminum present on the back of the insert is laser welded with the outer casing, also aluminum. This solution, on the other hand, requires the glass-to-metal sealing of the contacts at a temperature below the melting temperature of the aluminum since it is present in the oven during this step. In these two patents, the glass-metal seal is preferably made with glass-ceramics (Kryoflex® and Ceramax®). These have a significant concentration of lead oxide (see US4352951). These two solutions have the advantage of having a flexibility in the choice of the material of the outer casing of the connector: it suffices that the desired material can be bonded to stainless steel by one of the methods mentioned. But this involves many manufacturing steps to obtain a connector: realization of the multi-material plate, machining, glass-metal sealing, laser welding. This has a significant impact on the final price of the connector. In addition, the use of stainless steel, even austenitic (304L, 316L ...) implies a certain level of residual magnetism (of the order of a hundred nanoteslas). Another disturbing point is the use of a lead-oxide glass ceramic that does not comply with the RoHS directive.
    [0009] Thus, to avoid the magnetism associated with the use of stainless steel, it seems advantageous to achieve the glass-metal seal directly in an aluminum case. In addition, the advantage of using aluminum and its alloys for hermeticity is also due to their lightness and good heat dissipation. Indeed, they can be used to make boxes containing electronic components producing heat and heat will be evacuated by the housing. This avoids the use of heat sinks. In addition, some aluminum alloys are laser weldable, which is very interesting to achieve hermetic bonds with good reliability. Various glasses or glass-ceramics have been developed for glass-to-metal sealing in aluminum, often based on lead oxide (US4202700, US5262364, US6037539). Few compositions seem to have led to products on the market, apart from the composition ALSG-32. This composition was developed by Pr. Brow and has been marketed by major glass suppliers 20 (Ferro, Schott, Elan ...). Glass-to-metal seals were made with ALSG-32 glass at the University of California at Davis and good thermal, mechanical and vibration shocks were observed. But according to Pr. Brow himself, the design and geometry of the parts are very important to guarantee the success of the glass-to-metal seals. The difficulty would be to achieve close glass-to-metal seals, i.e. with little aluminum between two glass / glass-ceramic preforms. This is the case for the micro-D because the pitch is only 1.27mm and a contact diameter of 0.40mm is often used to ensure sufficient mechanical strength. A small thickness of aluminum means that compressive stresses are exerted on small volumes at each end of this metal. Thus, it is more likely to exceed the elastic limit in compression of aluminum in these areas, which would lead to a plastic deformation of the metal. Thus, the compression on the glass can decrease drastically and cause failures in the glass during temperature rises. This is all the more true as the sealing temperature of ALSG-32 glass is very high (about 550 ° C). Aluminum thus loses many of these mechanical characteristics after such a heat treatment and its yield strength drops.
    [0010] Some glass compositions have been developed without lead oxide for glass-to-metal sealing in aluminum (US4202700, FR2642257, US5965469) and some processes have been developed (FR2642257). These glasses are based on phosphates and are known to have low sealing temperatures and high CTEs, which seems rather attractive for glass-to-metal sealing of aluminum. In addition, commodities are common and inexpensive. However, experimentally, the inventors have realized that these glasses are not necessarily adapted to the needs in terms of wettability and especially insulation resistance (Comparative Example 1). These glasses therefore do not make it possible to obtain parts with a leak rate of less than 1 × 10 -9 mbar / sec. These glasses also have a capacitive effect, most certainly due to an ionic conduction of sodium ions, for example. Tellurium oxide glasses have been described in the prior art for glass-to-metal sealing of semiconductor packages (US4945071, US4743302, US5013697, US5116786). However these glasses include lead oxide which does not comply with the RoHS directive. Only the application WO9310052 describes a glass based on tellurium oxide without lead oxide. However, this glass is a binary tellurium oxide-vanadium oxide binary system and therefore does not suggest at any time that it is possible to remove the vanadium oxide from its composition. In addition, such glasses are not commercially available. Furthermore, this document still suggests the addition of lead oxide and only indicates that this type of glass can be used in the sealing of ceramic-based semiconductors. It therefore does not suggest at any time that it can be useful in the glass-to-metal sealing of aluminum or aluminum alloys and even less in the case of micro-D connectors.
    [0011] It is therefore necessary to find new glass compositions that comply with the RoHS directive and that can be used for glass-to-metal sealing of aluminum-based micro-D connector boxes so as to obtain a hermetic and possibly non-magnetic connector.
    [0012] The inventors have surprisingly found that it is possible to use tellurium oxide glasses, without lead oxide or vanadium oxide, for glass-to-metal contact sealing in a box, in particular of micro-D type connectors, so as to obtain hermetic, possibly nonmagnetic and RoHS compliant connectors, while using copper or copper alloy contacts. The present invention therefore relates to a tellurium oxide glass composition for glass-to-metal sealing of alloys or metals having a coefficient of thermal expansion greater than 16ppm / ° C, in particular greater than or equal to 16, 5 ppm / ° C, more preferably between 16.5 ppm / ° C and 30 ppm / ° C, said composition preferably comprising essentially consisting of, in particular, being in molar percentage: - between 60 and 80% of TeO 2, advantageously between 62 and 80%, more preferably between 64 and 79%, in particular between 64 and 70%, more particularly around 65%; between 5 and 35% of ZnO, advantageously between 10 and 34%, even more advantageously between 14 and 31%, especially between 18 and 31%, more particularly between 20 and 30%; an oxide selected from TiO 2, K 2 O and mixtures thereof, the TiO 2 content being between 0 and 15%, advantageously between 0 and 11%, and the K 2 O content between 0 and 30 ° C. / (:), preferably between 0 and 20 ° / (+), more preferably between 0 and 16%; between 0 and 15% of CsCl, advantageously between 0 and 11%; and unavoidable impurities, said composition being substantially free, in particular completely free, of lead oxide, sodium oxide and vanadium oxide.
    [0013] For the purposes of the present invention, the term "glass-to-metal seal" means the bond between two metals or metal alloys by means of glass. This connection involves in the case of connectors a hermetic connection that allows the passage of electrical information. Electrical insulation is therefore also implied.
    [0014] For the purposes of the present invention, the term "sealing temperature" means the temperature at which the glass and the metals must be heated in order to obtain the seal, ie to lower the viscosity of the glass and to create a bond between them. Advantageously these glasses do not include P204 phosphates. In fact, phosphates have a negative impact on the wettability of the glass. For the purposes of the present invention, the term "glass composition based on tellurium oxide" means any glass composition whose main component is tellurium oxide (TeO2) (more than 60 mol%).
    [0015] In one embodiment of the present invention, the alloy or metal having a coefficient of thermal expansion greater than 16 ppm / ° C. is chosen from: aluminum and its alloys, advantageously alloys aluminum silicon, aluminum magnesium or aluminum magnesium silicon such as, for example, alloys of the 4000 series (aluminum silicon), in particular alloys 4047 and 4032, alloys of the 5000 series (magnesium aluminum), in particular alloys 5083 and 5754 and alloys of the 6000 series. (magnesium aluminum silicon), especially alloy 6061; stainless steel, in particular 304L and 316L, copper and copper alloys having optionally undergone a surface treatment, in particular nickel-plated or nickel-gold-plated, advantageously a beryllium copper alloy, such as the copper alloy; Beryllium type 33, also called C17300 (1.8% Be, 0.2% Co and 0.2% minimum Pb for machinability) having optionally undergone a surface treatment, in particular nickel-plated or nickel-plated. In general, the coefficients of thermal expansion are for: - the beryllium copper alloy type 33: 17.3 ppm / ° C, - the alloys of aluminum: - the alloy 5083: 25.2ppm / ° C 20 - alloy 5754: 24,6ppm / ° C - alloy 6061: 23,4ppm / ° C - alloy 4032: 20,2ppm / ° C - alloy 4047: 19ppm / ° C - stainless steel 304L : 17ppm / ° C 25 - 316L stainless steel: 16.5ppm / ° C The thermal expansion coefficient (CTE) is measured in the context of the present invention on a TMA from TA instrument (TMA 2940), with a ramp 2 ° / min from 30 to 250 ° C.
    [0016] The composition according to the present invention comprises ZnO. ZnO allows the glass composition to have better stability, a slightly higher glass transition temperature Tg and a slightly lower CTE compared to K20 alone.
    [0017] The glass composition according to the present invention thus comprises an oxide selected from TiO 2, K 2 O and mixtures thereof. In an advantageous embodiment, the glass composition according to the present invention comprises TiO 2, advantageously in a molar percentage content of at most 15%, more preferably between 1 and 13% ( :), more preferably between 4 and 11 ° / (:), in particular between 4 and 6%, more particularly 5%. Indeed TiO2 seems to provide excellent durability to glass.
    [0018] In another embodiment, the glass composition according to the present invention comprises K20, advantageously in a molar percentage content of at most 30%, preferably between 1 and 20%. more preferably between 4 and 16%, especially between 5 and 15%. K20 is advantageously added as a partial substitution for ZnO. Thus, advantageously, the K 2 O + ZnO content of the composition according to the present invention is between 10 and 40%, more advantageously between 20 and 35%, in particular between 25 and 35%, in molar percentage. increases the coefficient of thermal expansion of the glass and also appears to improve its wettability. It also makes it possible to lower the glass transition temperature and therefore the sealing temperature of the glass composition according to the invention.
    [0019] In yet another embodiment, the glass composition according to the present invention comprises a mixture of K20 and TiO2, advantageously in a molar percentage content of TiO2 of at most 10% and K20 of at most 10%. 20 ° / (:), more preferably a TiO2 content of between 1 and 10 ° A) and a K20 content of between 1 and 20%. In a particular embodiment, the glass composition according to the present invention comprises CsCl. Indeed, the addition of this compound makes it possible to increase the band gap by reducing the energy of the valence band, which makes it possible to avoid the electronic conduction as much as possible. However, the content of CsCl must not be too high because this element has an impact on the wettability of the composition. Thus, advantageously, the content of CsCl in molar percentage is at most 15%, advantageously at most 11%, more advantageously between 0.5 and 15%, in particular between 0.5 and 11%, more particularly between 0.5 and 5%. In an advantageous embodiment, the glass composition according to the present invention has a coefficient of thermal expansion (CTE) of between 11 and 22 ppm / ° C, preferably between 11.5 and 19 ppm / ° C, more preferably between 12 and 16 ppm / ° C. In an advantageous embodiment, the glass composition according to the present invention has a lower CTE than the metal or metal alloy for glass-to-metal sealing. In another advantageous embodiment, the glass composition according to the present invention has a wetting angle of less than 100 °, preferably between 10 ° and 97 °, in particular between 18 ° and 96 °, measured in a controlled manner. optical, with a Nikkon camera (D5100, lens: AF-S Micro NiKKON 40mm 1: 2.8G) and freeware software Image].
    [0020] 3036396 13 A good wetting angle avoids the presence of air between the glass and the metal or metal alloy which avoids the problems of hermeticity. In another advantageous embodiment, the glass composition according to the present invention has a glass transition temperature (Tg) of less than 500 ° C., advantageously of between 250 and 400 ° C., in particular of between 300 and 350 ° C. . A low glass transition temperature results in a lower temperature glass-to-metal seal, which is useful for glass-to-metal sealing of aluminum alloys that have a low melting temperature. Indeed this avoids the softening of its alloys during the glass-metal sealing process. However, a glass transition temperature that is too low is not advantageous in the context of the present invention because it is necessary to obtain a connector having a temperature withstand of at least 200 ° C.
    [0021] Tg is measured by DSC (Differential scanning calorimetry): DSC setaram (DSC 131). The measurement is made from 20 to 580 ° C with a ramp of 10 ° C / min. Temperatures Tg and Tx are onset temperatures. In another advantageous embodiment, the glass composition according to the present invention has a chemical durability of between 1X10-5 and 1X10-7 g / (cm2. min) determined in Soxhlet at 95 ° C in demineralised water and continuously renewed according to IS016797.
    [0022] Examples of the glass composition according to the present invention are summarized in Table 1 below: Table 1: General data on glass compositions according to the invention 3036396 glass Composition Tg (° C) CTE (ppm / ° C) 1 (TeO2) 70 (1-102) (ZnO) 348 11.2 (TeO2) 78.9 ((20) 5.3 (ZnO) 15.8 273 18.6 3 (TeO2) 65 ( T102) 5 (ZnnO 346 13.6 4 (TeO2) 65 (T102) 5 (ZnO) 25 ((20) 5 327 14.6 (TeO2) 65 (T102) 5 (ZnO) 15 ((20) 15 273 21.56 (TeO2) 65 (1-102) 5 (ZnnO (K2O)) 296 18.47 (TeO2) 65 (TiO2) 5 (ZnO) 15 (K20) 15 + 1 wt% CsCl 272 21, 18 (TeO2) 65 (T102) 5 (ZnO) 15 ((20) 15 + 10 wt.% CsCl 254 9 (TeO2) 65 (T102) 5 (Zn0) 22 ((20) 8,310 16 The present invention relates to in addition, the use of the glass composition according to the invention, in particular as described above, for the glass-to-metal sealing of copper or a copper alloy, having optionally undergone a surface treatment (deposit of a metal layer on the surface), in particular nickel-plated or nickel-plated, advantage a beryllium copper alloy having optionally undergone a surface treatment, in particular nickel-plated or nickel-gold-plated, with an alloy or a metal having a coefficient of thermal expansion greater than 16 ppm / ° C., in particular different from copper or a copper alloy.
    [0023] For the purposes of the present invention, the term "copper or nickel-plated copper alloy" means any copper or copper alloy having undergone a surface treatment so as to deposit a thin layer of nickel on its surface, in particular by electrolysis or by a chemical deposition process. This nickel layer 15 generally also comprises phosphorus, advantageously in a molar percentage content of between 5 and 12%, in particular to make this nonmagnetic layer a molar percentage content of between 10.5 and 12%. The thickness of this layer is in general between 1 and 20 μm, in particular between 1 and 15 μm, advantageously between 1 and 7 μm.
    [0024] This layer may be supplemented with a layer of gold. This is called "copper or nickel-plated copper alloy" according to the present invention. In this case, each layer advantageously has a thickness of between 1 and 10 μm, in particular between 1 and 7 μm. In an advantageous embodiment, the alloy or metal having a coefficient of thermal expansion greater than 16ppm / ° C is as described above. In particular, the alloy or metal having a coefficient of thermal expansion greater than 16 ppm / ° C. other than copper or a copper alloy is chosen from aluminum and its alloys and stainless steel, advantageously it is a question of an aluminum alloy, in particular chosen from an aluminum silicon, magnesium aluminum or magnesium aluminum silicon alloy, more particularly as described above. In a particularly advantageous embodiment of the use according to the invention, the glass-metal seal is made in a connector, advantageously a miniature connector, in particular a micro-D connector (according to the Mil-DTL-83513 standard). between a copper or copper alloy contact, in particular a copper alloy such as a beryllium copper alloy, having optionally undergone a surface treatment, in particular a nickel-plated or nickel-gold-plated treatment, and an insert and / or housing metal or alloy having a coefficient of thermal expansion greater than 16ppm / ° C. The present invention furthermore relates to a connector comprising a copper or copper alloy contact, having optionally undergone a surface treatment, in particular a nickel-plated or nickel-gold-plated treatment, advantageously in a beryllium copper alloy, having optionally undergone a surface treatment, in particular nickel-plated or nickel-gilded, an insert and / or metal or alloy case having a coefficient of thermal expansion greater than 16ppm / ° C, in particular other than copper or a copper alloy, and a sealing material glass-metal between the contact and the insert and / or casing, characterized in that the sealing material is a tellurium oxide glass having the composition according to the invention, in particular as described hereinabove. above. Advantageously, the alloy or metal having a thermal expansion coefficient greater than 16ppm / ° C is as described above. In particular, the connector according to the invention is a miniature connector, more particularly a micro-D connector (according to the Mil-DTL-83513 standard).
    [0025] In an advantageous embodiment, the connector according to the invention is hermetic with a helium leakage rate of less than 1 × 10 -9 mbar / sec, advantageously less than 3 × 10-19 mbar / sec, measured at using a helium leak detector (ASM 142 from Adixen) according to the A4 requirements of MILSTD-883.
    [0026] In another advantageous embodiment, the connector according to the invention has an insulation resistance between the contacts and between each contact and the insert and / or housing> 5 GBhms, advantageously> 10 GBhms, in particular> 20 GBhms , measured using a 500V DC megohmmeter, in particular the Cable test device, Horizon II, model HV4. In yet another advantageous embodiment, the connector according to the invention has a use temperature of up to 200 ° C.
    [0027] Advantageously, the copper alloy or the copper of the contact is not nickel-plated and the alloy or metal having a coefficient of thermal expansion greater than 16 ppm / ° C. is chosen from aluminum and its alloys. Advantageously, in this case, the connector according to the invention is nonmagnetic with a residual magnetism <20nT, measured according to the GFSC-S-311 standard, using a three-dimensional magnetometer MEDA FVM400. The present invention finally relates to a glass-metal sealing process 5 of a copper or copper alloy contact, having optionally undergone a surface treatment, in particular nickel-plated or nickel-gold-plated, in an insert and / or metal case or alloy having a coefficient of thermal expansion greater than 16ppm / ° C, in particular other than copper or a copper alloy, comprising the following successive steps 10 -a) providing a copper or copper alloy contact , in particular beryllium copper alloy, having optionally undergone a surface treatment, in particular nickel-plated or nickel-plated, and an insert and / or metal or alloy case having a coefficient of thermal expansion greater than 16ppm / ° C, b) providing a preform, advantageously in cylindrical form, of tellurium oxide-based glass having the composition according to the present invention and in particular as described above; -c) contacting the preform with the contact and with the insert and / or the housing; d) maintaining contact of the contact-preform-insert and / or housing assembly by means of a suitable tooling; e) heating the contact-preform-insert and / or casing assembly at a temperature and for a time sufficient to obtain the glass-to-metal seal; f) recovery of the assembly thus sealed.
    [0028] Advantageously, the alloy or metal having a coefficient of thermal expansion greater than 16ppm / ° C is as described above.
    [0029] In a particular embodiment of the process according to the present invention, the temperature of step e) is between 350 and 500 ° C, in particular between 400 and 500 ° C, more particularly between 440 and 500 ° C.
    [0030] In another embodiment of the process according to the present invention the heating time of step e) is between 15 minutes and 2 hours, in particular between 30 minutes and 1 hour. The heating of step e) can be carried out for example by means of a furnace or by induction. The invention will be better understood in the light of the description of the figures and examples which follow.
    [0031] FIG. 1 shows an example of a 15-pin female micro-D connector according to Mil-DTL-83513. FIG. 2 represents a diagrammatic view of a sectional compression seal (FIG. 2A) and a top view (FIG. 2B) of a contact (1) in a case (3) using glass (2). according to the invention.
    [0032] Example 1: Glass-to-metal sealing between copper alloy contacts and an aluminum alloy case with glass compositions according to the invention The glasses whose composition is indicated in the following Table 2 were manufactured. Table 2: General data on 3 glass compositions according to the invention glass Composition Tg CTE Durability (g / (min.cm2) (° C) (ppm / ° C) 3 (TeO2) 65 (TiO2) 5 (Znn0 346 13 1,13X10-7-1,97X10-7 (TeO2) 65 (TiO2) 5 (ZnO) (K20) 296 18.49 (TeO2) 65 (TiO2) 5 (ZnO) 22 (K20) The values of chemical durability were determined in soxhlet at 95 ° C. in demineralized water and continuously renewed according to the standard IS016797. This is a very critical test because the dissolution rate remains at its maximum throughout the duration (no saturation of the water).
    [0033] The glass-to-metal seals with these glass compositions are made in aluminum alloy housings of the 4000, 5000 or 6000 families: 4047, 4032, 5083, 5754 or 6061. The contact used is made of copper alloy: beryllium copper type 33, also called C17300 (1.8% Be, 0.2% Co and 0.2% minimum Pb for machinability).
    [0034] The glass is provided as a cylindrical preform around each contact. To produce the glass-metal seals, the set of metal-glass preforms is held in place by means of adapted tools. The heating is carried out in an oven without an atmosphere protected at the temperature and for the times indicated in Table 3. The glass-to-metal sealing is done in compression at the level of the box as diagrammatically shown in FIG. in compression on all sides, except at the contact where there is a radial extension. The insulation resistance is measured using a megohmmeter under 500V DC. The insulation resistances obtained reach the detection limit of the device (20 GHz). Helium hermeticity is measured using a helium leak detector (ASM 142 from Adixen) according to MIL-STD-883, conditions A4. The measured leakage rates are at the detection limit of the apparatus during rapid measurement, i.e. less than 1 minute of measurement (3 × 10 -10mbar / sec). For the determination of the wetting angle θ, the glass is deposited on an aluminum foil and exposed in an oven at the indicated temperature for the time indicated in Table 3 (same temperature and duration as for the sealing process glass-metal). The whole is then taken out of the oven and the glass freezes immediately. The angle is then determined in an optical way, with a Nikkon camera (D5100, lens: AF-S Micro NiKKON 40mm 1: 2.8G) and freeware software Image]. Table 3 below presents the results obtained with these glasses.
    [0035] Table 3: Experimental data obtained with the glasses according to the invention in the process according to Example 1 glass Time / temperature 0 (°) Hermeticity Resistance Residual magnetism (nT) (min / ° C) from the operation to the sealing isolation helium (mbar.1 / s) (Gohm) 3 60/440 70-74 <3X10-1 °> 20 <20 60/460 42-39 6 60/440 41-39 <3X10-1 ° > 20 <20/500 21-28 60/440 96-87 <3X10-1 °> 20 <20 30/500 18-29 The various glass-metal seals made were then exposed to 5 cycles of thermal shocks -55 ° C + 125 ° C, with 30-minute steps in climatic chambers of the vertical shock type, for example of the brand 10 Climats. The hermeticity has been measured again: all the parts keep their hermeticity and the measured value is the limit of detection of the apparatus. Five thermal shock cycles ranging from -55 ° C to + 200 ° C were then performed on the same parts. The measured hermeticity revealed that, again, the parts have a leak rate lower than the detection limit of the apparatus. These glasses are therefore suitable for sealing glass-metal connectors. It is thus possible to obtain with these glasses, connectors, with copper alloy contacts, hermetic, non-magnetic, in compliance with the RoHS directive and having a working temperature of up to 200 ° C.
    [0036] Example 2: Glass-to-metal sealing between nickel-plated or nickel-plated copper alloy contacts and an aluminum alloy case with glass compositions according to the invention Two of the glass compositions described in Example 1 ( glasses number 3 and 5 9) were used for the glass-metal contact sealing of nickel-plated or nickel-plated beryllium copper alloy on an aluminum alloy case according to example 1. The glass-to-metal sealing process and the measurement methods are identical to those of Example 1. Only the contact is different since different surface treatments have been carried out on the beryllium copper alloy contacts of Example 1: nickel-plated and nickel-gold-plated contacts. In all cases, nickel (Ni) chemical was used with different levels of phosphorus (P). In the case of nickel-gilded contacts, gold (Au) nickel alloy was deposited by electrolysis after the deposition of nickel.
    [0037] The following Table 4 presents the results obtained with these glasses. Table 4: Experimental data obtained with the glasses according to the invention in the process according to Example 2 Glass Resistance Hermeticity Treatment Residual magnetism (nT) surface of helium isolation contact (mbar.1 / s) (Gohm ) 6pm Ni 11% P + <3X10-1 °> 20> 20 6pm At 3 6pm Ni 11% P + <3X10-1 °> 20> 20 6pm At 3 3pm Ni 6% P <3X10-1 °> 20> 20 3 5pm Ni 6% P <3X10-1 °> 20> 20 3 10pm Ni 11% P <3X10-1 °> 20> 20 It is possible to obtain with these glasses, hermetic connectors, compliant with the directive RoHS and with nickel-plated or nickel-plated copper alloy contacts. However these connectors are not non-magnetic, even if the contacts are initially (if the percentage of phosphorus in the surface treatment layer is greater than or equal to 10.5%).
    [0038] Example 3: Glass-to-metal sealing between copper alloy contacts and a stainless steel case with glass compositions according to the invention One of the glass compositions described in Example 1 (glass number 3) was used for sealing glass-metal contact beryllium copper alloy according to Example 1 on a 304L and 316L stainless steel case. The glass-metal sealing process and the measurement methods are identical to those of example 1. Only the case is different since it is a stainless steel case. The following Table 5 presents the results obtained with this glass.
    [0039] Table 5: Experimental data obtained with the glasses according to the invention in the process according to Example 3 Helicether melting glass mbar.1 / s) Insulation resistance (Gohm) 3 <3 × 10 -1 °> 20 Glass-to-metal sealing in stainless steel does not allow to obtain non-magnetic connectors. However, the connectors obtained with the glass composition according to the invention are hermetic.
    [0040] It is therefore possible to produce micro-D hermetic connectors with a stainless steel case and copper alloy contacts with a lead-free glass. Comparative Example 1: Phosphate glasses Phosphate glass compositions were tested for sealing beryllium copper alloy contacts in an aluminum alloy case. Phosphate glasses are generally known for their high water absorption. The compositions have therefore been optimized to improve durability by the presence of acidic oxides such as Al 2 O 3, which create network-reinforcing AlPO 4 groups, or the presence of amphoters such as Nb 2 O 5. The glasses whose composition is indicated in the following Table 6 have therefore been manufactured. Table 6: General data on 5 phosphate glass compositions 3036396 23 glasses Composition Tg CTE Durability (° C) (ppm / ° C) (g / cm 2 min) 11 (NaPO 3) 36 (KPO 3) 36 (3a (PO 3) 2) 12 (Al 2 O 3) 8 (Al (PO 3) 3) 8 380 1.23 X 10 -6 12 (NaPO 3) (KPO 3) 35 (Ca 2 (P 2 O) 2) (Al 2 O 3) 3.65 (Al (PO 3 380 14, 1.68X10-6,,,,,,,,,,,,, (3) (P03) 2) 12.5 (Nb205) 12.5 381 16.8 1.28 X 10- (NaPO 3) (KO 3) (Ca 2 (P 2 O) 2) (Al 2 O 3) 3.65 (Al (PO 3) 3) i.65 (ZnF 2) 360 360 (NaPO 3) (KPO 3) (Ca 2 (P207) 2) (A1203) 3.65 (A1 (PO 3) 3) 1.65 (ZnF 2) 10 (CuF 2) 5 362 129 - For the glass-to-metal seals, the metals and process used are the same as in Example 1. The heating is performed in an oven under atmosphere, but we could consider other modes of heating to achieve the glass-metal seal.
    [0041] The methods of measurement are identical to those of Example 1. The following Table 7 presents the results obtained with these glasses. Table 7: Experimental data obtained with the glasses of phosphate glasses Time (min) / O Hermeticity with Resistance Magnetism Temperature (° C) (°) the helium of residual isolation of the operation of (mbar.1 / s) ( Gohm) (nT) sealing 11 - - 9.5X10-6- 0.3-14 <20 5.2X10-8 12 60/500 104- 4X10-4- 4X10-9 0.2-0.5 <20 108 14 -> 1OE5 1,2-2,2 <20 32 60/480 115 1,3X10-5 2 <20 34 60/500 113- 4X10-5 0,1 <20 117 These glasses are therefore not adapted to the needs in terms of wettability and especially insulation resistance.
    [0042] In fact, the wetting angles determined, as well as the glass-to-metal seals made, show a lack of wettability that is evident at the level of the aluminum. It has been noticed that even by increasing the temperature and the time in the oven, these glasses do not have better wettability.
    [0043] 3036396 24 These glasses therefore do not make it possible to obtain parts with a leak rate of less than 1X10-9 mbar.1 / s. In addition, the insulation resistance is absolutely not stable according to the tests, certainly because of the more or less important presence of air between the glass and the aluminum. These glasses also have a capacitive effect, most certainly due to an ionic conduction, sodium ions for example. Comparative Example 2: chalcogenide glasses Three chalcogenide glasses were synthesized because they had Tg and CTE that could meet the needs according to the literature. Their characteristics are presented in Table 8 below. Table 8: General data on 3 glass chalcogenide glass compositions Composition Tg (° C) CTE (ppm / ° C) 20 Ge23Sb10S63 + 10% CsCI 260 approx 20 22 Ge26Sb10S24 340 approx 16 26 15 Ga2S3 - 75 GeS2 - 10 CsCl 370 These glasses have been abandoned after wettability tests because they require a glass-metal seal under a controlled atmosphere to prevent their oxidation. Comparative Example 3: Alkaline Glasses An alkali-free alkali-free glass sold commercially under the name Msoft 5 from Mansol preforms was tested in the glass-to-metal setting frame of copper alloy contacts on a metal alloy case. 'aluminum. Its characteristics are presented in Table 9 below. Table 9: General data on the composition of the alkaline glass Name Type of glass CTE Commercial temperature (PPITV ° C) sealing (° C) Msoft 5 Alkaline glass 16,0 560-600 303 6 3 96 25 To make glass-to-glass seals metal, the same process as that in Example 1 was followed with a temperature of 570 ° C for 1 hour, only the tested glass was changed. However, it has not been possible to make parts whose leakage rate is measurable with alloys 4000 and 5083. These have a relatively low melting point and their surface deforms and oxidizes enormously during glass sealing. -metal. The surface is therefore no longer smooth enough to ensure uniform compression of the seal and a hermetic seal. The measurement methods are identical to those of Example 1. The following Table 10 presents the results obtained with this glass. Table 10: Experimental data obtained with an alkaline glass Contact Insulation resistance (Gohm) leakage rate Helium magnetism (mbar.1 / s) residual (nT) Contact naked <3X104 ° 0,2-0,5 < Nickel-plated contact (10pm Ni <3X101 ° 0.3-1> 20 11% P) The helium leakage rate obtained on the various connectors is below the detection limit of the measuring device during the test. a rapid measurement, that is to say less than 1 minute of measurement. On the other hand, the measured insulation resistance is much lower than desired. A capacitive effect is observed, i.e. the resistance increases with the time of application of the voltage, as when charging a capacitor. This is typical of ionic conduction. Since the glass is based on alkalis, it is highly probable that small alkaline ions, such as sodium ions, are responsible for this conduction.
    [0044] Indeed, these ions being small, they can easily move in the glass if the iono-covalent bonds linking them to the rest of the network have too low a power compared to the attraction of the applied negative voltage. Thus, during the application of the voltage, the Na + ions move towards the negative electrode. The resistance is very low initially. Then, it increases as the ions reach this pole. During a polarity inversion, this phenomenon starts again.
    [0045] In order to increase the insulation resistance, tests have been carried out by pre-oxidizing the surface of the contact (see Table 11 below). Indeed, the oxide layer adds an insulating layer between the contact and the glass, which is likely to increase the insulation resistance.
    [0046] Table 11: Experimental data obtained with an alkaline glass and a pre-oxidized contact contact (time and temperature of the Leakage Resistance Magnetism preoxidation rate) with residual isolation helium (nT) (mbar.1 / s) ( Gohm) Pre-oxidized bare contact (200 ° C / 5min) <3X10-1 ° 1-2 <20 Nickel plated then pre-oxidized contact <3X10-1 ° 1-22> 20 (530 ° C / 10min) Unfortunately, There is a great variability of insulation resistance according to the tests. There are two reasons for this observation. First, the oxide thicknesses created may not always be the same, and during glass-to-metal sealing, the oxide may dissolve in the glass. Thus, if the oxide is not thick enough in places, one can end up with zones without oxide after glass-metal sealing. Secondly, when placing the contact in the tooling, oxide could be removed during handling. Indeed, it would suffice to scratch removing the oxide to locally eliminate this insulating layer. Obtaining sufficient insulation resistance is therefore not an easy thing and it is risky to rely solely on the oxide to guarantee it. This alkaline glass can not be used in the intended application.
    权利要求:
    Claims (15)
    [0001]
    REVENDICATIONS1. A tellurium oxide glass composition for glass-to-metal sealing of alloys or metals having a coefficient of thermal expansion greater than 16ppm / ° C, said composition comprising, advantageously consisting essentially of, in mole percent: between 60 and 80% of TeO 2, advantageously between 64 and 79 ° A); between 5 and 35% of ZnO, advantageously between 14 and 31%; an oxide selected from TiO 2, K 2 O and mixtures thereof, the TiO 2 content being between 0 and 15%, advantageously between 0 and 11% and the K 2 O content between 0 and 30% preferably between 0 and 20 ° A); - between 0 and 15 ° A) of CsCl; and unavoidable impurities, said composition being substantially free of lead oxide, sodium oxide and vanadium oxide. 15
    [0002]
    2. Glass composition according to claim 1, characterized in that the alloy or the metal having a coefficient of thermal expansion greater than 16ppm / ° C is selected from aluminum and its alloys, preferably an aluminum alloy silicon, aluminum magnesium or silicon magnesium aluminum, stainless steel, copper and optionally nickel-plated or nickel-gold-plated copper alloys, advantageously an optionally nickel-plated or nickel-gilded beryllium copper alloy.
    [0003]
    3. Glass composition according to any one of claims 1 or 2, characterized in that it comprises TiO2 in a molar percentage content of at most 15 ° / (:), advantageously between 1 and 13 25 ° A:), more preferably between 4 and 11%.
    [0004]
    4. A glass composition according to any one of claims 1 to 3, characterized in that it comprises K20 in a molar percentage content of at most 30 ° / (:), advantageously between 1 and 20 ° / (+), more preferably between 4 and 16%.
    [0005]
    5. Glass composition according to any one of claims 1 to 4, characterized in that the coefficient of thermal expansion of the glass is between 11 and 22 ppm / ° C, preferably between 12 and 16 ppm / ° C.
    [0006]
    6. Use of the glass composition according to any one of claims 1 to 5 for the glass-to-metal sealing of copper or a copper alloy, optionally nickel-plated or nickel-gold plated, preferably a beryllium copper alloy, optionally nickel-plated or nickel-gilded, with an alloy or metal having a coefficient of thermal expansion greater than 16ppm / ° C, in particular other than copper or a copper alloy.
    [0007]
    7. Use according to claim 6, characterized in that the alloy or metal having a coefficient of thermal expansion greater than 16ppm / ° C other than copper or a copper alloy is selected from aluminum and its alloys and stainless steel, advantageously it is an aluminum alloy selected from an aluminum alloy silicon, aluminum magnesium or aluminum magnesium silicon.
    [0008]
    8. Use according to any one of claims 6 or 7, characterized in that the glass-metal seal is performed in a connector, preferably a micro-D connector between a copper or copper alloy contact, optionally nickel-plated or nickel-gilded, and an insert and / or alloy or metal case having a coefficient of thermal expansion greater than 16ppm / ° C.
    [0009]
    9. Connector comprising a copper or copper alloy contact, optionally nickel-plated or nickel-plated, advantageously beryllium copper alloy, optionally nickel-plated or nickel-plated, an insert and / or metal or alloy housing having a coefficient of thermal expansion greater than 16ppm / ° C and a glass-to-metal sealing material between the contact and the insert and / or housing, characterized in that the sealing material is a tellurium oxide-based glass having the composition as defined in any one of claims 1 to 5.
    [0010]
    10. Connector according to claim 9, characterized in that the alloy or metal having a coefficient of thermal expansion greater than 16ppm / ° C is selected from aluminum and its alloys and stainless steel, advantageously it is a question of an aluminum alloy selected from an aluminum alloy silicon, aluminum magnesium or aluminum magnesium silicon.
    [0011]
    Connector according to one of claims 9 or 10, characterized in that it is a micro-D connector.
    [0012]
    12. Connector according to any one of claims 9 to 11, characterized in that it is hermetic with a helium leakage rate of less than 3X10-1 ° mbar.1 / s, has an insulation resistance between the contacts and between each contact and the insert and / or housing> 5 GBhms and has a temperature of use of up to 200 ° C.
    [0013]
    13. Connector according to any one of claims 9 to 12, characterized in that the copper alloy or the copper of the contact is not nickel-plated, in that the alloy or metal having a coefficient of thermal expansion greater than 16 ppm / ° C is selected from aluminum and its alloys and the connector is non-magnetic with residual magnetism <20nT.
    [0014]
    14. Glass-to-metal sealing process of a copper or copper alloy contact, possibly nickel-plated or nickel-plated, in an insert and / or metal or alloy case having a coefficient of thermal expansion greater than 16ppm / ° C , in particular other than copper or a copper alloy, comprising the following successive steps -a) providing a copper or copper alloy contact, optionally nickel-plated or nickel-plated, and an insert and or metal or alloy housing having a coefficient of thermal expansion greater than 16ppm / ° C, in particular other than copper or a copper alloy; b) providing a tellurium oxide glass preform having the composition as defined in any one of claims 1 to 5; 5 -c) contacting the preform with the contact and with the insert and / or the housing; d) maintaining contact of the contact-preform-insert and / or housing assembly by means of adapted tools; e) heating the contact-preform-insert and / or casing assembly at a temperature and for a time sufficient to obtain the glass-to-metal seal; f) recovery of the assembly thus sealed.
    [0015]
    15. The method of claim 14, characterized in that the temperature of step e) is between 350 and 500 ° C. 15
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    同族专利:
    公开号 | 公开日
    FR3036396B1|2020-02-28|
    EP3297966B1|2020-11-25|
    CN107690423B|2021-02-19|
    US10723648B2|2020-07-28|
    DE16729961T1|2018-12-13|
    CN107690423A|2018-02-13|
    EP3297966A1|2018-03-28|
    WO2016189225A1|2016-12-01|
    US20190337836A1|2019-11-07|
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    法律状态:
    2016-05-23| PLFP| Fee payment|Year of fee payment: 2 |
    2016-11-25| PLSC| Search report ready|Effective date: 20161125 |
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    优先权:
    申请号 | 申请日 | 专利标题
    FR1554634|2015-05-22|
    FR1554634A|FR3036396B1|2015-05-22|2015-05-22|GLASS COMPOSITION FOR SEALING MICRO-D CONNECTOR|FR1554634A| FR3036396B1|2015-05-22|2015-05-22|GLASS COMPOSITION FOR SEALING MICRO-D CONNECTOR|
    EP16729961.9A| EP3297966B1|2015-05-22|2016-05-19|Glass composition for micro-d connector sealing|
    US15/573,724| US10723648B2|2015-05-22|2016-05-19|Glass composition for micro-D connector sealing|
    PCT/FR2016/051177| WO2016189225A1|2015-05-22|2016-05-19|Glass composition for micro-d connector sealing|
    CN201680029617.3A| CN107690423B|2015-05-22|2016-05-19|Glass composition for micro-D connector sealing|
    DE16729961.9T| DE16729961T1|2015-05-22|2016-05-19|Glass composition for micro-D connector sealing|
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